Jörg Strogies

-Focus of recent work innovative planar power electronics for Siemens Digital Industries/Motion Control

-Strong capabilities of conceptualization and design and comprehensive of all technological processes for power packaging like sintering, soldering, potting, wire bonding

-General electronics packaging knowledge (solder paste printing, automated assembly, inspections)

• Passionate about learning and committed to continual improvement.
• Provided professional services and support in a dynamic work environment.

Expert for development of new memory products wafer level packages

Research and Development of Advanced Smart Power Packaging Solutions (Focus Flip Chip)

International supplier Relations (Japan, Korea, Taiwan) in terms of substrates, underfill, soldermasks ...