Mohammad Khodashenas

PROFILE & AMBITION I am an accomplished engineer and project manager with extensive hands-on experience in developing and industrializing semiconductor devices for both German and international companies. My career has evolved over the years, starting as a process engineer in lithography and quality management for ASIC and MEMS products. Subsequently, I transitioned into project management roles, overseeing the development and industrialization of ASIC integrated MEMS sensors (such as microphones and pressure sensors), Bulk acoustic waves RF filters, and ultrasound transducers. As I look to further develop my career and seek professional growth within the semiconductor industry, my focus remains on project management. Over the past 8 years, I have successfully led and managed projects from their initial phases to project completion. My ultimate goal is to challenge myself by being part of an innovative environment that encourages pushing the boundaries. I am eager to tackle challenging real-life problems and transform them into technical solutions that provide a competitive advantage to customers. A company culture that prioritizes teamwork and a commitment to delivering tangible, measurable results while fostering a friendly and respectful work environment is of utmost importance to me. I am excited about the opportunities that lie ahead and am ready to contribute my expertise and leadership skills to a dynamic and forward-thinking organization in the semiconductor industry.

• Qualcomm, Project Manager
• Project Goal: Development of new BAW filter for upcoming 5G technologies
• Tasks: The frequency and electrical power required to achieve the 5G band were significantly higher than those of the 4G technology
• One of the challenges was the tight deadline in response to market demands, particularly the need to test the first 5G components on Apple and Samsung products
• Additionally, we faced difficulties in developing new processes and materials to attain the high frequency and power levels required for 5G
• In the context of a BAW filter, the thickness of the layers and their mechanical and electrical properties play a crucial role in achieving the final specification
• Market requirements and competition forced us to frequently revise the project deliverables and timeline during its course
• As the project leader, from project definition to project closure, I had to implement change management strategies over time, emphasizing clear communication and cooperation among the project team, stakeholders, and other departments
• X-FAB MEMS Foundry GmbH, Project Leader
• Project Goal: Development of Wafer level packaging of ASIC integrated MEMS microphone
• Tasks: Leading the project presented significant challenges
• The utilization of double- side wafer processing, a complex process in the semiconductor industry, involved
• CMOS processing on the front side of the wafer and MEMS on the backside
• Integrating CMOS and MEMS further added to the complexity
• To overcome these challenges, we ventured beyond conventional packaging methods and devised a novel wafer-level packaging approach
• As the project leader, conducting an initial brainstorming session proved crucial
• It allowed us to explore innovative developments and determine the necessary resources, including engineers, materials, tools, subcontractors, and research institutes
• Throughout the project, I effectively coordinated and facilitated communication among team members, ensuring regular updates to stakeholders
• Managing the project budget posed a significant challenge due to numerous changes in the project scope and new requests from subcontractors
• I am pleased to report that we successfully completed the project, achieving our goal of a robust MEMS microphone with exceptional noise performance and sensitivity
• This accomplishment signifies the dedication and collaborative efforts of the entire team in realizing the project's objectives.

• CURRICULUM VITAE

Scrum Master I